cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 1/6 sk12sa thru sk1bsa cystek product specification 1.0amp. surface mount schottky barrier diodes sk12sa thru sk1bsa features ? for surface mounted applications. ? for use in low voltage, high frequency inverters, fr ee wheeling, and polarity protection applications. ? plastic material used carries underwriters laboratory flammability classification 94v-0. ? low leakage current. ? high surge capability. ? high temperature soldering: 250 c/10 seconds at terminals. ? exceeds environmental standards of mil-s-19500/228. mechanical data ? case: molded plastic, jedec do-214ac/sma. ? terminals: solder plated, solderable per mil-std-750 method 2026. ? polarity: indicated by cathode band. ? mounting position: any. ? weight: 0.064 gram, 0.002 ounce. ordering information device package shipping marking sk12sa-0-t4-g sk12 sk13sa-0-t4-g sk13 SK14SA-0-T4-G sk14 sk15sa-0-t4-g sk15 sk16sa-0-t4-g sk16 sk18sa-0-t4-g sk18 sk1bsa-0-t4-g sma (pb-free lead plating and halogen-free package) 7500 pcs / tape & reel sk1b environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t4 : 7500 pc s / tape & reel, 13? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 2/6 sk12sa thru sk1bsa cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60hz, re sistive or inductive load. for capacitive load, derate current by 20%. ) type parameter symbol sk12 sk13 sk14 sk15 sk16 sk18 sk1b units repetitive peak reverse voltage v rrm 20 30 40 50 60 80 100 v maximum rms voltage v rms 14 21 28 35 42 56 70 v maximum dc blocking voltage v r 20 30 40 50 60 80 100 v maximum instantaneous forward voltage @ i f =1a (note 1) v f 0.5 0.7 0.85 v maximum average forward rectified current @ t l =100 c i o 1 a peak forward surge current @ 8.3ms, single half sine-wave superimposed on rated load (jedec method) i fsm 30 a maximum dc reverse current at rated dc blocking tj=25 c voltage tj=100 c i r 0.5 10 ma typical thermal resistance, junction to lead r th, ja 85 c/w typical thermal resistance, junction to case r th, jc 18 c/w t a =25 c 1.5 power dissipation t c =25 c p d 7 w typical diode junction capacitance @ f=1mhz and applied 4v reverse voltage c j 120 pf storage temperature tstg -55 ~ +150 c operating temperature t j -55 ~ +125 c recommended soldering footprint
cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 3/6 sk12sa thru sk1bsa cystek product specification characteristic curves sk12-sk14 sk16 sk18-sk1b
cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 4/6 sk12sa thru sk1bsa cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 5/6 sk12sa thru sk1bsa cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c752sa issued date : 2006.07.13 revised date :2014.02.05 page no. : 6/6 sk12sa thru sk1bsa cystek product specification sma/do-214ac dimension marking : sk12sa sk13sa sk14sa sk15sa sk12 sk13 sk14 sk15 sk16sa sk18sa sk1bsa sk16 sk18 sk1b sma/do-214ac plastic surface mounted package cystek package code : sa *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.055 0.062 1.40 1.60 e 0.006 0.012 0.152 0.305 b 0.098 0.114 2.50 2.90 f 0.002 0.008 0.051 0.203 c 0.157 0.181 4.00 4.60 g 0.030 0.060 0.76 1.52 d 0.078 0.096 2.00 2.44 h 0.188 0.208 4.80 5.28 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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